SpecificationsDocumentsDescriptionDimensions
Brand | | Tyco Electronics |
Comment | | Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
Device Type | | BGA |
Diameter (mm (in)) | | 34.95 [1.376] |
Fan Type | | No Fan |
Finish | | Black Anodize |
Flammability Rating | | UL 94V-0 |
For Use With | | BGA Semiconductor Packages |
Heat Sink Type | | Pin Fin 1 |
Height (mm (in)) | | 12.70 [0.500] |
Lead Free Solder Processes | | Not relevant for lead free process |
Line | | ChipCoolers |
Material | | Cold-Forged Aluminum |
Package Size (mm (in)) | | 27 [1.064] |
Product Type | | Heat Sink |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |