CIN::APSE® Solderless Compression Connector Technology

Connection

The connectors are constructed by two main components, insulating housing and an electrically conducting contact. The liquid crystal polymer insulators are molded and the contacts are a bundled gold-plated molybdenum wire. Gold plated copper spacers are used for long Z-axis connectors.

Positioning

The positioning is designed into the insulating housing. Insulation housing are molded for high volume and machined for prototypes.

Mounting

The connectors are positioned and mounted between boards and components using generally available alignment and compression hardware. Hardware can be press fit into PCB or utilized with a bolster plate for maintaining even compression across a large socket. Designers recommend PCB layout for gold plated pads and alignment holes locations.

High Density

• Maximize SWaP (Size, Weight, and Performance) for space and weight constrained designs
• Pitch grid of 2.00 mm, 1.0 mm and 0.80 mm achievable
• Thin profiles from 0.020" and greater
• 2-piece design reduces additional space and weight

Solderless

• Compression sufficient for establishes multiple points of contact, RoHS compatible
• No thermal processing or X-ray inspection required
• Reversible mating process for multiple cycles

Customizable

• Design team available for mechanical drawings and product sketches
• Prototypes available for low quantities
• Profile thicknesses from 0.020" to 1.0"
• 2 to 7,356 contacts have been used per connector, but no limit exists
• IC-to-PCB, PCB-to-PCB, Flex-to-PCB, Component-to-PCB

Reliable

• Excellent shock and vibration stability, 100 Gs shock, 20 Gs vibration
• Thermally stable, life and cycle testing, 5,000 hrs @ 170°C
• Electrically stable, > 1,000 MΩ @ 500 VDC

Webinar: Solving extreme vibration, shock, speed and space issues using Cin::APSE® technology

Cinch CIN::APSE® Product Deep Dive