Samtec SEARAY™ High Density Open Pin Field Arrays
Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open-pin-field arrays. These high speed, high density open-pin-field arrays allow maximum grounding and routing flexibility. They support 56 Gbps PAM4 applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.
Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- Performance up to 28 Gbps NRZ/56 Gbps PAM4
- Up to 560 I/Os in an open-pin-field design
- 1.27 mm (.050") pitch (Space saving 0.80 mm pitch system also available)
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- 7 - 40 mm stack heights
- Vertical, right-angle, press-fit
- 85 Ω systems
View Samtec Molex Product Intermateability Specification for SEARAY™
Contact your local sales office or email [email protected] for more information.
SEAF
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket
Features
- Up to 500 I/Os
- Rugged Edge Rate® contact
- 56 Gbps PAM4 performance
- SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
- .050" (1.27 mm) pitch
- Stack heights from 7 mm - 18.5 mm
- Lower insertion/withdrawal forces
- Solder charge termination
- Analog Over Array™ capable
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
SEAM
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal
Features
- Up to 500 I/Os
- Rugged Edge Rate® contact
- 56 Gbps PAM4 performance
- SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
- .050" (1.27 mm) pitch
- Lower insertion/withdrawal forces
- Solder charge termination
- Stack heights from 7 mm - 18.5 mm
- Analog Over Array™ capable
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
SEAF-RA
SEARAY™ High-Speed Right-Angled Open-Pin-Field Array Socket, .050" Pitch
Features
- High-density open-pin-field array
- Right-angle design
- .050" (1.27 mm) pitch
- Rugged Edge Rate® contact
- Lower insertion/withdrawal forces
- Solder charge termination
- Guide post, latching post options
SEAM-RA
.050" SEARAY™ High-Speed Right-Angled Open-Pin-Field Array Terminal
Features
- High-density open-pin-field array
- Right-angle design
- .050" (1.27 mm) pitch
- Rugged Edge Rate® contact
- Lower insertion/withdrawal forces
- Solder charge termination
- Guide post, latching post options
SEAMP
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit
Features
- Termination: Press-fit
- High-density open-pin-field array
- Rugged Edge Rate® contact
- 28 Gbps performance
- Lower insertion/withdrawal forces
- 7 mm, 8 mm, 8.5 mm and 9.5 mm stacks
SEAFP
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Press-Fit
Features
- High-density open-pin-field array
- Press-fit tails
- Rugged Edge Rate® contact
- Lower insertion/withdrawal forces
- 7 mm to 16 mm stack heights
SEAFP-RA
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Right-Angle Press-Fit
Features
- High-density open-pin-field array
- Press-fit tails
- Rugged Edge Rate® contact
- Lower insertion/withdrawal forces
- Right-angle
SEAR
.050" SEARAY™ High-Speed High-Density Riser, 85 Ohm
Features
- SEARAY™ riser
- Up to 40.00 mm stack
- 85 ohm
SEAMI
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm
Features
- High-density open-pin-field array
- 85 ohm tuned
- Performance to 14 Gbps
JSO
SureWare™ Jack Screw Precision Board Stacking Standoff
Features
- Works as a traditional standoff
- Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF, ADM6/ADF6 and other high-normal-force connectors
- Reduces risk for component damage on boards
- Board stacks from 4.00 mm to 16.00 mm
- Press-fit and threaded bases available
GPPK
SureWare™ Guide Post, Mates with GPSK
Features
- Accommodates blind mating in perpendicular applications
- Mates with GPSK guide post socket
- Pairs with most high-speed connector strips and arrays
GPSK
SureWare™ Right-Angle Guide Post Socket
Features
- Accommodates blind mating in perpendicular applications
- Mates with GPPK Series guide post
- Use with PCB thickness of .062" (1.60 mm) to .125" (3.18 mm)
- Pairs with most high-speed connector strips and arrays